Our Die Bond Tools
At Leader Hi-Tech, we offer a comprehensive range of die bond tools designed to meet the diverse needs of microelectronic assembly. Our selection includes ejector needles for precise die placement, rubber tips for delicate handling, and carbide tips known for their durability and longevity. Additionally, we provide epoxy stamping tools ideal for controlled adhesive applications, ensuring accuracy and reliability in your assembly processes.
Our Wire Bond Tools
We offer a wide range of wire bond tools designed for precision and reliability in microelectronic assembly. The selection includes capillary tools for accurate wire placement, wedge bond tools for secure connections, and carbide tips known for their durability and performance.
Additionally, shear pins and specialized shear tools are available for precise bond strength testing, along with wire pull hooks for evaluating wire integrity. These tools cater to fine-pitch and heavy-wire applications, ensuring efficiency and superior performance across various manufacturing needs.
Our QA Tools
We provide a range of quality assurance (QA) tools designed to ensure precision and reliability in semiconductor manufacturing. Our offerings include wire hooks, engineered for accurate wire pull testing across various wire sizes, and shear pins, crafted from high-hardness carbide material for precise die and ball shear testing.
These tools are essential for maintaining the integrity and performance of microelectronic assemblies, supporting rigorous testing and quality control processes.