Category: Die Bond Tools
Our rubber pick up tools are designed to accommodate everything from bump dies to LED packages. We offer standard rubber tips made from NBR (Nitrile Butadine Rubber) and high-temperature variants made from Viton, capable of withstanding temperatures up to 250°C.
Rubber collets are perfect for handling sensitive surface dies, providing the necessary cushioning during pick-up processes. We offer a range of material hardness options from 50HRC to 80HRC to suit your specific needs.
Additionally, we provide extensive customization options for complex applications to ensure our products meet your unique requirements.
Leader Hi-Tech offers a comprehensive range of rubber tips, including Round Micro Series (7-10mils), Round Small Series (11-30mil), Round Standard (31mils and above), Square Micro Series (8-10mils), Square Small Series (11-30mil), Square Standard (31mils and above), Square Flat Tip Series, X-Groove Series, Multi-Hole Series, and Custom Design options to meet diverse production needs.
Our Rubber Tips / Rubber Collet
CUSTOMIZED SIZES AND SHAPES
FOR ALL TYPE OF BONDER MAKERS
CUSTOM DESIGNS RUBBER COLLET
Understanding Rubber Tips in Semiconductor Die Bond, Wire Bond, and Tape and Reel Machines
Rubber tips, also known as rubber collet, are critical components in semiconductor manufacturing processes, particularly in die bond, wire bond, and tape and reel machines. These tips play a significant role in handling delicate components without causing damage or contamination.
Die Bond Machines: In die bonding, rubber tips are used during the pick-up and placement of semiconductor dies onto substrates. The softness and flexibility of rubber tips provide cushioning, ensuring the delicate dies are handled gently. This prevents damage and maintains the integrity of the components throughout the bonding process. The variety of tip sizes and configurations allows for precise manipulation of various die sizes.
Wire Bond Machines: In wire bonding, rubber tips assist in positioning and securing the semiconductor die and wires. These tips help prevent static discharge and mechanical damage that can occur during the bonding process. Their anti-static properties and gentle handling ensure the wires and dies are precisely and safely bonded, which is crucial for maintaining the quality and reliability of the semiconductor device.
Tape and Reel Machines: In tape and reel packaging, rubber tips are used to pick and place semiconductor devices onto carrier tapes for transportation and storage. The rubber tips provide the necessary grip and cushioning to handle the devices without scratching or damaging them. This ensures that the semiconductor components remain in pristine condition until they reach their final destination.
Overall, rubber tips are indispensable in these machines, offering the necessary precision, protection, and customization to handle various semiconductor components effectively. Whether dealing with bump dies, LED packages, or sensitive surface dies, rubber tips play a vital role in ensuring high-quality, reliable semiconductor manufacturing.
FAQs About Rubber Tips / Rubber Collet
What are rubber tips used for in die bonding?
Rubber tips are used in die bonding to handle delicate semiconductor components without causing damage. They provide a softer, non-abrasive surface that helps prevent scratches or cracks during the bonding process.
How do rubber tips differ from carbide tips in die bonding?
While carbide tips are used for high-precision and durability, rubber tips are preferred for applications requiring gentle handling of fragile components. Rubber tips are ideal for sensitive materials that may be prone to breakage or surface defects.
Can rubber tips be customized for specific bonding machines?
Yes, rubber tips can be customized to fit various bonding machines and application requirements. Custom designs ensure optimal performance and compatibility with specific semiconductor manufacturing processes.
About LeaderRange Hitech Sdn Bhd
At LeaderRange HiTech, we specialize in supplying high-quality rubber tips for a range of semiconductor die bonding applications. Designed for gentle handling and precision, our rubber tips are ideal for protecting delicate components during the bonding process.
With a commitment to innovation and customer satisfaction, we provide customized solutions to meet the unique requirements of both local and international markets.