High-Quality Wire Bond Tools for Reliable Connections
Discover our premium wire bond tools, meticulously designed to ensure precision and dependability in microelectronic assembly. Our product line includes capillary tools for accurate wire placement, wedge bond tools for robust connections, and high-durability carbide tips for extended performance. We also offer shear pins and a specialized shear tool for precise bond strength testing, as well as a wire pull hook for effective wire integrity evaluation. These tools are perfect for fine-pitch and heavy-wire applications, catering to diverse manufacturing needs.
Enhance your wire bonding process with our expertly crafted tools, engineered to deliver superior performance, reliability, and efficiency in every application.
EFO (Electrode Flame Off) plays the role of firing the Bonding wire for ball formation. The consistency and conductivity of the electrode has a direct impact on the roundness of formation.
This formation has a direct impact on the bonding strength and stability. We use high purity 99.95% platinum for optimum conductivity. There is also an alternative of tungsten material which is cheaper to replace.
High-Quality Die Bond Tools for Precision Applications
Explore our range of premium die bond tools, designed for accuracy and reliability in microelectronic assembly. Our offerings include ejector needles for precise die placement, rubber tips for delicate handling, and carbide tips for durability and long-lasting performance. Additionally, we provide epoxy stamping tools, ideal for controlled adhesive applications. Whether you require tools for high-precision tasks or robust solutions for demanding environments, our die bond tools deliver exceptional results tailored to your needs.
Upgrade your assembly process with our expertly crafted tools, built to ensure efficiency and precision in every application.